48759-1 - TE Application Tooling - WESAN

48759-1

Product overview

Part Number: 48759-1

Manufacturer: TE Application Tooling

Product Category: Crimpers - Crimp Heads, Die Sets

Description: TOOL DIE AMPLI-BOND 69066 4/0AWG

Documents & Media

Datasheets: 48759-1

Description

TOOL DIE AMPLI-BOND 69066 4/0AWG

Price & Procurement

Associated Product

XC7K325T-2FFG900I

XILINX

DC:21+ IC FPGA 500 I/O 900FCBGA
MT40A512M16LY-062E IT:E

MICRON

IC DRAM 8GBIT PARALLEL 96FBGA
LTM4630IV#PBF

Analog Devices Inc.

DC DC CNVRTR 0.6-1.8V 0.6-1.8V
8543BGILF

Renesas Electronics America Inc

IC CLK BUFFER 2:4 650MHZ 20TSSOP
TST-108-05-S-D-RA

Samtec Inc.

CONN HEADER R/A 16POS 2.54MM
MKV10Z128VLH7

XILINX
VL53L1CBV0FY/1

MICRON
PCT2075D

Analog Devices Inc.
MP6550GG-P

Renesas Electronics America Inc

1.8V TO 22V, 2A, H-BRIDGE MOTOR
MSP430G2433IRHB32R

Samtec Inc.

CONN HEADER R/A 16POS 2.54MM

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