HSE-B18318-0396H - CUI Devices - WESAN

HSE-B18318-0396H

产品概览

产品型号: HSE-B18318-0396H

制造商: CUI Devices

产品类别: Thermal - Heat Sinks

产品描述: HEAT SINK, EXTRUSION,TO-218, 31.

文档与媒体

数据列表: HSE-B18318-0396H

产品描述

HEAT SINK, EXTRUSION,TO-218, 31.

采购与价格

推荐产品

XC7K325T-2FFG900I

XILINX

DC:21+ IC FPGA 500 I/O 900FCBGA
MT40A512M16LY-062E IT:E

MICRON

IC DRAM 8GBIT PARALLEL 96FBGA
LTM4630IV#PBF

Analog Devices Inc.

DC DC CNVRTR 0.6-1.8V 0.6-1.8V
8543BGILF

Renesas Electronics America Inc

IC CLK BUFFER 2:4 650MHZ 20TSSOP
TST-108-05-S-D-RA

Samtec Inc.

CONN HEADER R/A 16POS 2.54MM
MKV10Z128VLH7

XILINX
VL53L1CBV0FY/1

MICRON
PCT2075D

Analog Devices Inc.
MP6550GG-P

Renesas Electronics America Inc

1.8V TO 22V, 2A, H-BRIDGE MOTOR
MSP430G2433IRHB32R

Samtec Inc.

CONN HEADER R/A 16POS 2.54MM

您可能在找

AD9517-4ABCPZ-RL7 SI5335D-B07807-GMR SI5335A-B06500-GMR SI5335B-B08708-GM SI5340B-D07770-GMR SI5335D-B09186-GMR SI5335D-B03102-GMR SI5317A-C-GMR 8N9PF10VA-167NRGI SI5335D-B07898-GMR SI5335A-B06608-GMR SI5335B-B08722-GM SI5340B-D07785-GMR SI5335D-B09256-GMR SI5335D-B03111-GMR LMK03002ISQ/NOPB ADF4158WCCPZ-RL7 SI5335D-B07903-GMR SI5335A-B06631-GMR SI5335B-B08855-GM